Nice working enviroment and good corporate culture;
1.Responsible for the daily maintenance of Linux servers.
2.Responsible for the maintenance of the R&D intranet, including configuration, debugging, upgrading, and monitoring of network devices.
3.Responsible for the optimization of file systems, high-performance networks, and Linux systems.
4.Cooperate with CAD to upgrade EDA and manage permissions.
Job Descriptions
1.Bachelor's degree or above in Electronics.
Communications, Computer Science, or related fields. 2.5+ years of experience in Linux IT operations.
3.Familiarity with operations tools such as Ansible.
4.Familiarity with monitoring systems such as Zabbix, Prometheus, or Nagios.
5.Experience in deploying High-Performance Computing (HPC) environments.
6.Proficiency in at least one distributed file system, such as GlusterFS, Ceph, BeeGFS, or Lustre.
7.Proficiency in at least one local file system, such as EXT4, XFS, or ZFS.
8.Familiarity with RDMA deployment, such as RoCE.
9.Experience in deploying LDAP, Windows AD domain, and Kerberos.
10.Preference given to candidates with experience in scripting languages such as shell, Python, or Perl.
11.Preference given to candidates with experience in distributed job management tools such as SGE, LSF, or OpenLava.
12.Strong work ethic, positive attitude, and excellent communication and teamwork skills.
1.Complete the design of analog circuits, such as PMU (Power Management Unit), ADC (Analog-to-Digital Converter), and interface modules in ASIC or analog chips.
2.Collaborate with Layout Engineers to complete floor planning, layout optimization, and post-layout verification.
3.Assist Test Engineers in developing test plans.
4.Support AE (Applications Engineer) / FAE (Field Applications Engineer) in resolving issues encountered by customers.
1.Master's degree or above in Microelectronics, Electronic Engineering, or related fields.
2.Over five years of working experience.
3.Experience in designing power management modules or chips, such as BUCK, BOOST, LDO (Low Dropout Regulator), LED Driver, Motor Driver, Charge Pump, Class D amplifiers, and high-voltage design.
4.Experience in designing signal chain modules or chips, such as ADC, DAC (Digital-to-Analog Converter), OPA (Operational Amplifier), and active filters.
5.Experience in designing interface and clock modules or chips, such as SerDes (Serializer/Deserializer), CMU/PLL (Clock Management Unit/Phase-Locked Loop), LIN/CAN PHY (Local Interconnect Network/Controller Area Network Physical Layer).
6.ESD (Electrostatic Discharge) design experience, including low-voltage and high-voltage ESD circuits and ESD device design.
7.Preference given to candidates with experience in automotive-grade circuit development.
1.Collaborate with chip designers to define the design-for-testability (DFT) architecture.
2.Responsible for DFT-related tasks in SoC chips, including Scan, MBIST (Memory Built-In Self-Test), ATPG (Automatic Test Pattern Generation), Boundary Scan, etc.
3.Conduct ATE (Automatic Test Equipment) testing after tape-out, including vector debugging, coverage optimization, and troubleshooting various issues encountered during testing.
1.Bachelor's degree or above, with more than 3 years of experience in digital or DFT design.
2.Familiarity with boundary scan logic, ATPG (Automatic Test Pattern Generation), MBIST (Memory Built-In Self-Test) logic, and mixed-signal testing.
3.Proficient in Verilog design language.
4.Proficient in scripting languages such as TCL, Perl, and Python.
5.Familiarity with D toolsFT; preference given to candidates with experience in using MODUS.
1.Based on the chip product planning feedback from the company's market/business development department, be responsible for the product definition and management of automotive motor control SoC, Driver, Pre-driver, and (or) power ICs (high/low-side drivers, ASICs, domain control power ICs). Coordinate with application, R&D, and operations departments to complete chip requirement decomposition and design, and follow up on the entire product process.
2.Spend part of the time (in collaboration with other colleagues) supporting customer presentations, exhibitions, capturing and organizing customer requirements, following up on major projects with top-tier customers, and engaging with industry associations and ecosystems.
1.Bachelor's degree or above.
2.Background in motor control or automotive power IC chip applications (PM, marketing, AE, FAE) or design experience (outgoing personality and smooth communication skills); experience in product management or product definition is preferred.
3.Familiarity with chip R&D design, ATE (Automatic Test Equipment), packaging, and testing processes; knowledge of automotive chip development.
1.Lead a process R&D team focused on BCD (Bipolar-CMOS-DMOS) process development for the company.
2.Develop process development plans and strategies, and track the latest trends and advancements in the industry.
3.Design new devices, conduct TCAD (Technology Computer-Aided Design) simulations, and create test structures.
4.Integrate process flows, design process experiments, and test and analyze device parameters.
5.Assist in resolving process-related issues in product design, and improve the yield and reliability of mass-produced products.
6.Manage the team to ensure timely project completion. Responsible for recruitment, training, and performance evaluation of team members.
1.Master's degree in Microelectronics, Integrated Circuits, Physics, Materials Science, or related fields.
2.Over 10 years of experience in process and device development, with in-depth understanding of device physical characteristics and expertise in BCD processes.
3.Strong logical thinking, analytical skills, and communication abilities. Self-motivated, with management experience preferred.
4.Experience working in a Fab (fabrication facility) or IDM (Integrated Device Manufacturer) company in device and process development. Preference given to candidates with eFlash (embedded flash) related experience.
1.Responsible for the schematic design and PCB layout of hardware test boards.
2.Responsible for the soldering (hand soldering) of PCB circuit boards.
3.Verify the accuracy of components on the single board designed by electronic engineers and assist with procurement.
4.Possess good communication skills to promptly identify and report soldering issues to engineers, and assist with some chip testing tasks.
5.Complete other tasks assigned by the supervisor.
1.Proficient in using hardware design software AD (Altium Designer) to design schematics and PCBs.
2.Skilled in circuit board soldering techniques and able to correctly identify various electronic components.
3.Proficient in using tools such as soldering irons and hot air guns, and experienced in soldering through-hole, surface-mount components, and IC chips. Familiar with various test equipment, including power supplies, multimeters, and oscilloscopes.
4.Hardworking, detail-oriented, and responsible. Possess a strong sense of responsibility and a willingness to take on tasks diligently.